Scotch-Weld™ 021200-49125 Hot Melt Adhesive, Light Amber, 5/8 in Dia x 8 in L, 130 deg F, 35 s Application, 24 hr Curing

19591252 MFG #: 021200-49125
$0.00 / Each
Item currently not in stock. Lead time based upon availability from the manufacturer.
  • Diameter: 5/8, 5/8 in
  • Length: 8, 8 in
  • Bonds To: Chipboard, Foam, Paper, Uncoated Cardboard and Wood
  • Temperature Rating: 130, 130 deg F
  • Application Time: 35, 35 sec
  • Curing Time: 24, 24 hr
  • Peal Strength: 6 psi
  • Shear Strength: 480 psi
  • Tensile Strength: 600 psi
  • Material: Ethylene Vinyl Acetate
  • Color: Light Amber
Scotch-Weld™ Hot Melt Adhesive, 5/8 in Diameter, 8 in Length, Bonds To: Chipboard, Foam, Paper, Uncoated Cardboard and Wood, 130 deg F, 35 s Application Time, 24 hr Curing, Light Amber
QTY
  • Aggressive hot tack rapidly achieves handling strength for packaging and other application
  • Medium open time allows for positioning and fit adjustment
  • Securely bonds difficult to seal substrates such as lightly waxed surfaces
  • Virtually invisible when bonded, eliminating unattractive mechanical fasteners and tape pr
  • Ethylene vinyl aceta
  • Bonds to corrugated
  • Ethylene vinyl acetate adhesive
  • Heat-resistance of 130 deg F
  • Heat-resistance of 1
  • Low melt, stick form
  • Heat resistance of 1
  • For use with polygun
  • For use with polygun EC applicator
  • Material compatibili
  • Short open time allo
  • Short open time allows for fast assembly lines
  • Low viscosity preven
  • Low viscosity prevents stringing even at fast production speeds
Aggressive hot tack rapidly achieves handling strength for packaging and other applications
Medium open time allows for positioning and fit adjustment
Securely bonds difficult to seal substrates such as lightly waxed surfaces
Virtually invisible when bonded, eliminating unattractive mechanical fasteners and tape products
Ethylene vinyl acetate adhesive
• Bonds to corrugated or paperboard cartons, wood, particle board, chipboard and cushioning foams
Ethylene vinyl acetate adhesive
Heat-resistance of 130 deg F
Heat-resistance of 130 deg F
Low melt, stick form
• Heat resistance of 130 deg F
For use with polygun EC applicator
For use with polygun EC applicator
• Material compatibility chipboard, foam, paper, uncoated cardboard and wood
Short open time allows for fast assembly lines
Short open time allows for fast assembly lines
Low viscosity prevents stringing even at fast production speeds
Low viscosity prevents stringing even at fast production speeds